Engineered Conductive Materials Debuts Low-Temperature Curing Conductive Adhesive for OLED & OPV Applications

Engineered Conductive Materials, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces the DB-1569-1 Low Temperature Curing Conductive Adhesive for use in organic light-emitting diodes (OLEDs) and organic photovoltaics (OPVs). This material formulation has been optimized for excellent conductivity and stability on various substrates when cured at 80°C or higher.

DB-1569-1 is more than 90 percent cured after 30 minutes at 80°C, with a dispensing work life greater than 48 hours (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. DB-1569-1 features extreme flexibility that is ideal for flexible applications with high peel strength to withstand the stresses induced in flexible BIPV and display applications. This material also can be fast cured at elevated temperatures (1minute @ 180°C).

DB-1569-1 is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives focused on photovoltaic, LED and circuit assembly applications.

Engineered Conductive Materials (ECM)
www.conductives.com